Sited in Rousset near Marseille in the beautiful South of France,
Smart-Packaging-Solutions S-P-S was founded in 2003 by spinning of from the "world biggest smart card manufacturer".
All smart card related topics and issues are very well covered by
S-P-S due to the tremendous background in this industry, adding up to more than 100 years of experience.
The focus on semiconductor packaging on flexible substrates, the human capital, and the high level patent portfolio makes
S-P-S to the most valuable partner to provide and to develop technologies, processes, and materials.
Contactless inlays for identification, banking, and transport.
These secured and reliable contactless products are working on E-Booster technology. This technology is based on a specific electromagnetic coupling between an antenna module (E-Pastille) and a specific antenna (E-Booster). E-Pastille in a high reliable, flat, and thin microelectronic packaging.
These inlays are available in different form factors fully compliant with ID-1, ID-3, mini cards ID-0, embossed contactless cards, and custom sized cards (on demand). Available materials are PVC, PC, and Polyesters.
Common contactless card exhibit a reliability between the micro-module and the antenna embedded into the card body. The connection (by soldering, thermo-compression or electrical conductive adhesive) are not reliable and long-lasting.
The technology is fully compliant the ISO/IEC standards 14443, 7816, and 10373 showing outstanding mechanical robustness (up to 300 times bending and torsion cycles conform ISO 10373).
more >>Dual Interface Card technology
The only reliable interconnection technology between a module and an antenna for a long term application is provided and patented by S-P-S. The SunCombi principle is based on a specific electromagnetic coupling between the module and a booster antenna that simply amplifies the electromagnetic field from the card reader. This outstanding and revolutionary technology overcomes the weakness of a common dual interface card with a mechanical interconnection between the micro-module and the antenna embedded into the card body. The resulting product is extremely robust and offers mechanical characteristics never been reached before.
For the card manufacturer it is the easiest way to enter the production of dual interface cards, without even investing in specific and expensive embedding equipment.
S-P-S's offer includes the antenna prelaminated and reels of micro-modules (SunCombi modules) with/wiht out hotmelt adhesive laminated on the tape. This semi-finished product enables the card manufacturer to easily produce its own dual interface cards by embedding the module into the card.
more >>WWW.S-P-S.COM
