Thies Janczek was born in May, 1968 in Kiel, Germany.
More than 25 years of broad experience in the mechanical, semiconductor and
smart card industry in production and R&D made him a knowledgeable partner for clear solutions to complex tasks.
WORK HISTORY
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2004 –
to date |
COCASO
Molfsee, Schleswig-Holstein, Germany
Technical Consulting for the security, card and printing industry.
Accredited Mastercard CQM Auditor. |
1998 –
2003 |
ORGA Kartensysteme GmbH (Morpho Cards)
Flintbek, Schleswig-Holstein, Germany
Head of Research and Development Card Technology |
1995 –
1998 |
Siemens HL (Infineon)
Semiconductor Factory Regensburg, Bavaria, Germany
Development Engineer, Semiconductor Packaging (e.g. DRAM, Sensors, Chip Card Module, RFID Inlays) |
1994 –
1995 |
ZaMa GmbH
Bordesholm, Schleswig-Holstein, Germany
Engineer for production planning and –organization, construction, technical calculation and assembly instruction |
1993 –
1994 |
Zipperling, Kessler & Co. GmbH (Clariant)
Ahrensburg, Schleswig-Holstein, Germany
Thesis. Topic: Impact resistance and structure of multiple phase polymer systems |
1992 –
1992 |
Deutsche Airbus
Stade, Niedersachsen, Germany
Quality assurance on Prepreg-Laminates |
1990 –
1991 |
ZaMa GmbH
Bordesholm, Schleswig-Holstein, Germany
Metal working in gear production
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EDUCATION
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1993 –
1994 |
University of Massachusetts, Lowell
Lowell, Massachusetts, USA
graduated as Master of Science in Plastics Engineering June 1994 |
1989 –
1994 |
Technical College of Rosenheim
Rosenheim, Bavaria, Germany
graduated as "Diplom Ingenieur (FH)" in June 1994
|
1978 –
1987 |
High School Humboldt-Schule
Kiel, Schleswig Holstein, Germany
graduated in June 1987 |
PAPERS |
| October 1997 |
First IEEE International Symposium on Polymeric Electronic Packaging, October, 26th-30th, 1997 Norrköping, Sweden.
Paper: Material investigation for pressure sensor package
P-DSOF-8-1. |
| October 2000 |
ICMA's 10th Annual Card Manufacturing EXPO 2000, Scottsdale (Phoenix), Arizona, USA, October, 31st 2000.
Paper: RPC® - A novel Smart Card Material based on recycled Compact Discs. |
| October 2004 |
ICMA's 14th Annual Card Manufacturing EXPO 2004, Prague, Czech Republic, October, 17th-20th 2004.
Paper: A Survey on Dual Interface and Multi Technology Cards. |
| October 2005 |
ICMA's 15th Annual Card Manufacturing EXPO 2005, Miami, Florida, USA, October, 16th-19th 2005.
Paper: Business Models and Technology Advances in Dual Interface and Multi Technology Cards. |
| October 2006 |
ICMA’s 16th Annual Card Manufacturing EXPO2006,
Athens, Greece, October 8th-11th 2006.
Paper: Digital Printing Personalization – Market
Survey on the Technologies and their Impact to Card
Production. |
April
2007 |
ICMA's Spring Academy Workshop, Rome, Italy,
April 18th-19th 2007.
Paper: Multi-component Cards - Actual Status and Upcoming Technologies. |
April
2008 |
ICMA’s 18th Annual Card Manufacturing EXPO2008,
Orlando, Florida, USA, April 6th-9th 2008.
Paper: Production of Laminated Cards for High End Applications. |
April
2009 |
ICMA’s 19th Annual Card Manufacturing EXPO2009,
San Juan, Puerto Rico, March 30th - April 2nd 2009.
Paper: Survey - European Card Market Development./td>
|
September
2009 |
Rosenheimer Kunststofftage 2009,
Technical University of Rosenheim,
Rosenheim, Germany, September 29th-30th 2009.
Paper: Plastic Engineering in Smart Card Technology.
|
May
2010 |
ICMA’s 20th Annual Card Manufacturing EXPO2010,
Scottsdale, AZ, USA, May 02-05th 2010.
Paper: PVC Analysis – General Overview and Card Industry Relation.
|
May
2011 |
ICMA’s 21st Annual Card Manufacturing EXPO2011,
Hollywood, FL, USA, May 01-04th 2011
Paper: Card Quality Management in Card Production and Personalization.
|
October
2011 |
ICMA’s Euroforum 2011,
Munich, Germany, October 12-13th 2011.
Paper: Card Quality Management in Card Production and Personalization.
|
October
2015 |
ICMA’s Euroforum 2015,
Munich, Germany, October 08-09th 2015.
Paper: Card Quality Management - CQM Version 2.15 update
|
October
2016 |
ICMA’s CardTrex 2016,
Vienna, Austria, October 13-14th 2016.
Paper: Card Quality Management - CQM Version 2.16 update
|
March
2017 |
ICMA’s 27th Annual Card Manufacturing EXPO2017,
Orlando, FL, USA, March 27-30th 2017.
Paper: Card Quality Management - CQM Version 2.16
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Specific Projects and Skills
Lead auditor and consultant for Quality Management and Physical Security installations in various industries on a world wide scale.
Start up and ramp up of laboratories, development teams, prepress, and card production in various companies.
Mastercard International CQM Auditor for IC manufacturer, Card manufacturer and Personalizer with worldwide far more than 100 audits since 2004.
Initiation of a funded project to develop OFETs (Organic Field Effect Transistors) by printing electrical active and insulating structures, with the focus to develop low cost semiconductor functionality, e.g. for a simple RFID tag.
Active Participation in the RESET Roadmap 5.0 (Roadmap for European research on Smartcard rElated Technologies), a funded project by the European community, which shows the necessity of electronic connections (not only antenna structures) on flex (mainly PVC) to connect several devices (display, keyboard, speaker, biometric device etc.) on a card.
More than 30 national and international Patents in the electronic packaging and smart card field.
Review patents at the European Patent Office at esp@cenet.
more >>>
Participation on the editorial development of Mastercard’s (former Europay’s) CQM documentation since 1998.
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